The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circ

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving spe

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manuf

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliabilit