Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics:

Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: written by G. S. Oehrlein and published by Cambridge University Press. This book was released on 2014-06-05 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.