Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications
| Author | : Swagata Riki Banerjee |
| Publisher | : |
| Total Pages | : 382 |
| Release | : 2005 |
| ISBN-10 | : MINN:31951P00861181O |
| ISBN-13 | : |
| Rating | : 4/5 (1O Downloads) |
Book Synopsis Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications by : Swagata Riki Banerjee
Download or read book Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications written by Swagata Riki Banerjee and published by . This book was released on 2005 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:
