Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect mater

The chapters covered in this book include emerging new techniques on sintering. Major experts in this field contributed to this book and presented their researc

Bridging the gap between textbook science and real-world engineering and operational applications, this reference presents comprehensive and easy-to-follow summ

The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intellig

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces