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Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2017-02-03 - Publisher: CRC Press
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementati
Language: en
Pages:
Pages:
Type: BOOK - Published: 2011 - Publisher:
Advancements in very large scale integration (VLSI) technology have led to unprecedented transistor and interconnect scaling. Further miniaturization by traditi
Language: en
Pages: 217
Pages: 217
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int