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Design And Modeling For 3d Ics And Interposers
Language: en
Pages: 379
Authors: Madhavan Swaminathan
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Design and Modeling for 3D ICs and Interposers
Language: en
Pages: 379
Authors: Madhavan Swaminathan
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
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The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementati
Modeling, Design, and Characterization of Through Vias in Silicon and Glass Interposers
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Advancements in very large scale integration (VLSI) technology have led to unprecedented transistor and interconnect scaling. Further miniaturization by traditi
3D Integration in VLSI Circuits
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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int