Related Books
Language: en
Pages: 392
Pages: 392
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Language: en
Pages: 770
Pages: 770
Type: BOOK - Published: 2017-07-04 - Publisher: Newnes
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Language: en
Pages: 292
Pages: 292
Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law
Language: en
Pages: 328
Pages: 328
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
Language: en
Pages: 365
Pages: 365
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa