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Advances In 3d Integrated Circuits And Systems
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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Three-Dimensional Integrated Circuit Design
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Authors: Vasilis F. Pavlidis
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Three-Dimensional Integrated Circuit Design
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Authors: Yuan Xie
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Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media

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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law
Design of 3D Integrated Circuits and Systems
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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
Wafer Level 3-D ICs Process Technology
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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa