Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4
Author :
Publisher : John Wiley & Sons
Total Pages : 655
Release :
ISBN-10 : 9783527697069
ISBN-13 : 3527697063
Rating : 4/5 (69 Downloads)

Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 655 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.


Handbook of 3D Integration, Volume 4 Related Books

Handbook of 3D Integration, Volume 4
Language: en
Pages: 655
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Handbook of 3D Integration, Volume 3
Language: en
Pages: 484
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2014-04-22 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
Language: en
Pages: 1079
Authors:
Categories: Technology & Engineering
Type: BOOK - Published: 2019-08-27 - Publisher: World Scientific

DOWNLOAD EBOOK

Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliabilit
Handbook of 3D Integration, Volume 4
Language: en
Pages: 488
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate