Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
| Author | : W.-P. Dow |
| Publisher | : The Electrochemical Society |
| Total Pages | : 57 |
| Release | : 2018-09-21 |
| ISBN-10 | : 9781607688549 |
| ISBN-13 | : 1607688549 |
| Rating | : 4/5 (49 Downloads) |
Book Synopsis Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB by : W.-P. Dow
Download or read book Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB written by W.-P. Dow and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt:
