Micromanufacturing Engineering and Technology

Micromanufacturing Engineering and Technology
Author :
Publisher : William Andrew
Total Pages : 429
Release :
ISBN-10 : 9780815519805
ISBN-13 : 081551980X
Rating : 4/5 (05 Downloads)

Book Synopsis Micromanufacturing Engineering and Technology by : Yi Qin

Download or read book Micromanufacturing Engineering and Technology written by Yi Qin and published by William Andrew. This book was released on 2010-07-02 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micromanufacturing Engineering and Technology presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential. The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging. - Presents case studies, material and design considerations, working principles, process configurations, and information on tools, equipment, parameters and control - Explains the many facets of recently emerging additive / hybrid technologies and systems, incl: photo-electric-forming, liga, surface treatment, and thin film fabrication - Outlines system engineering issues pertaining to handling, metrology, testing, integration and software - Explains widely used micro parts in bio / medical industry, information technology and automotive engineering - Covers technologies in high demand, such as: micro-mechanical-cutting, lasermachining, micro-forming, micro-EDM, micro-joining, photo-chemical-etching, photo-electro-forming, and micro-packaging


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