Advances in Electronic Packaging, 2001

Download or read book Advances in Electronic Packaging, 2001 written by Yung-Cheng Lee and published by . This book was released on 2001 with total page 2036 pages. Available in PDF, EPUB and Kindle. Book excerpt: This three-volume set of the proceedings of the July 2001 conference presents information from both academia and industry on advances in electronic packaging. Volume 1 (75 papers) discusses electrical design, simulation, and test; MEMS; materials and processing; and modeling and characterization. Volume 2 (106 papers) covers thermal management reliability. Volume 3 (88 papers) addresses manufacturing, microelectronics systems and exploratory topics, optoelectronic and photonic packaging, RF microwave, telecommunications, education, and packaging technologies. It also contains a keynote lecture on consortium activity for system integration in Japan. There is no subject index. c. Book News Inc.